MicroAssembly Technologies
Materials & Devices
Product
Full Automatic Die Bonder for MCM
Hybrid
Flip Chip
Eutectic
Ultrasonic
Silver Glass
Die Stacking
Ag Sinter, etc
Hybrid
Flip Chip
Eutectic
Ultrasonic
Silver Glass
Die Stacking
Ag Sinter, etc
Web site
www.mat-ltd.com open_in_new
Resources
MicroAssembly Technologies Presentation (pdf) file_download